Method of dicing a semiconductor wafer

Details Method of dicing a semiconductor wafer Method of dicing a semiconductor wafer

1985-02-26

1986-09-09

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29580, 29581, 29582, 29413, 29414, 148DIG28, H01L 21304

Patent

active

046100792

ABSTRACT:
A method of dicing a semiconductor wafer in which a physical discontinuity is formed on the surface of the wafer on both sides of a dicing line to limit the spreading of cracks and chips generated during dicing. Thereafter, the semiconductor wafer is diced to separate the pellets.

REFERENCES:
patent: 3608186 (1971-09-01), Hutson
patent: 3628106 (1971-12-01), Frank et al.
patent: 3628107 (1971-12-01), Kennedy
patent: 3852876 (1974-12-01), Sheldon et al.
patent: 3972113 (1976-08-01), Nakata et al.
patent: 4033027 (1977-07-01), Fair et al.
patent: 4040877 (1977-08-01), Johnson et al.
patent: 4096619 (1978-06-01), Cook
patent: 4135291 (1979-01-01), Tursky et al.
patent: 4179794 (1979-12-01), Kosugi et al.
patent: 4217689 (1980-08-01), Fujii et al.
patent: 4236296 (1980-12-01), Woolhouse et al.
patent: 4237601 (1980-12-01), Woolhouse et al.
patent: 4259682 (1981-03-01), Gamo
patent: 4355457 (1982-10-01), Barlett et al.

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