Thermal measuring and testing – Determination of inherent thermal property – Thermal conductivity
Patent
1989-05-05
1991-04-09
Cuchlinski, Jr., William A.
Thermal measuring and testing
Determination of inherent thermal property
Thermal conductivity
374 29, 374 43, G01N 2518
Patent
active
050059858
ABSTRACT:
A method for determination of the thermal conduction coefficient of a material sample comprises measurement of momentary temperature differences between two opposite surfaces of the material sample and measurement of heat supplied by a heater. Said material sample is placed in a system composed of the heater, two identical reference samples having known thermal conduction coefficient and two heat sinks. The material sample and the heater are sandwiched between the two heat sinks. All of them as so arranged are maintained in thermal contacts with each other. The measurements are made during a continuous linear change of the temperature of the two heat sinks. The thermal conduction coefficient of the material sample is determined on the basis of the following equation: ##EQU1##
REFERENCES:
patent: 3263485 (1966-08-01), Mahmoodi
patent: 3279239 (1966-10-01), Arends
patent: 3733887 (1973-05-01), Stanley et al.
patent: 3971246 (1976-07-01), Sumikama et al.
patent: 4630938 (1986-12-01), Piorkowska-Pakzewska et al.
patent: 4859078 (1989-08-01), Bowman et al.
Hager, Jr., "Miniature Thin-Heater Thermal Conductivity Apparatus," Proc. 5th Annual ISA Test Measurement Symposium, New York (Oct. 1968).
Galeski Andrzej
Piorkowska-Galeska Ewa
Cuchlinski Jr. William A.
Gutierrez Diego F. F.
Polska Akademia Nauk Centrum Badan Molekularnych i Makromolekula
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