Method of determining remaining film thickness in polishing...

Details Method of determining remaining film thickness in polishing... Method of determining remaining film thickness in polishing...

2006-05-02

2006-05-02

Picard, Leo (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S164000, C438S692000, C451S029000

Reexamination Certificate

active

07039488

ABSTRACT:
A method of determining remaining film thickness in polishing process provides a technology for controlling a polishing amount of CMP in a device isolating process with satisfactory accuracy regardless of the ratio between the area of each of device forming regions and that of each of trench regions, the type of abrasive, etc.

REFERENCES:
patent: 6690045 (2004-02-01), Shinkawata
patent: 6905966 (2005-06-01), Morita
patent: 2004/0121613 (2004-06-01), Morita
patent: 2002-140655 (2002-05-01), None
patent: 2002-342399 (2002-11-01), None

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