Method of determining position on a wafer

Details Method of determining position on a wafer Method of determining position on a wafer

1983-08-24

1986-01-28

Rosenberger, R. A.

Optics: measuring and testing

By alignment in lateral direction

With registration indicia

250548, G01B 1100, G01N 2186

Patent

active

045667969

ABSTRACT:
An alignment system and method is provided having an alignment target pattern formed on a semiconductor wafer, with means for scanning that target pattern to produce signals representing dimensions of individual features therein and distances between adjacent features, and with means for interrogating these signals to determine the relative position and distance of the scanned portion of the target pattern from a predetermined reference position. The target pattern includes one or more series of concentric figures, each figure having a particular dimension which differs from the particular dimension of each adjacent figure by a predetermined magnitude and being spaced from adjacent figures by predetermined distances. These predetermined distances and magnitude are detected from the scanning means signals and are used to determine the distance and direction of the scanning position from a reference position.

REFERENCES:
patent: 3796497 (1974-03-01), Mathisen et al.
patent: 4037969 (1977-07-01), Feldman et al.
patent: 4070117 (1978-01-01), Johannsmeier et al.
patent: 4153371 (1979-05-01), Koizumi et al.
patent: 4167677 (1979-09-01), Suzki
patent: 4209830 (1980-06-01), Arimura et al.
"Automatic Wafer Alignment Technique for the 700SLR/800SLR Wafer Steppers"; J. Lauria and T. Kerekes; Sep. 30, 1980.
"Application of Zone Plates to Alignment in Microlithography"; M. Feldman, A. D. White and D. L. White; Aug. 14, 1981.
"Stepping into the 80's with Die-By-Die Alignment"; Dr. Harry L. Stover; May 1981.

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