Method of determining order of wire-bonding

Details Method of determining order of wire-bonding Method of determining order of wire-bonding

1996-02-05

1997-07-15

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228102, H01L 2160

Patent

active

056475276

ABSTRACT:
The present invention provides a method of determining an order of wire-bonding between a plurality of leads and a plurality of electrodes, the leads being arranged in two arrays, the electrodes being disposed intermediate between the two arrays of leads in a line on a semiconductor, the method including the steps of (a) surveying whether, if a first wire for connecting a first electrode to a first lead is extended beyond the first electrode, the extended first wire would intersect with a second wire for connecting a second electrode to a second lead, and (b) carrying out wire-boding for the first wire and then wire-bonding for the second wire if the extended first wire would intersect with the second wire.

REFERENCES:
patent: 5269452 (1993-12-01), Sterczyk
Electronics, "High-speed-wire and-solder technique tests connections as it makes them", Whitehead, Bob, pp. 111-117, vol. 50, No. 8 Apr. 14, 1977.
IBM Texhnical Disclosure Bulletin, "Alternative to Inteposer for Small Chips in Package", vol. 33, No. 12, p. 22-25 May 1991.

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