Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2000-06-02
2004-03-30
Wu, Jingge (Department: 2623)
Image analysis
Applications
Manufacturing or product inspection
C382S145000, C382S147000, C382S199000, C382S218000
Reexamination Certificate
active
06714671
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Technical Field of the Invention
In the examination of patterns such as the wiring patterns of semiconductors, printed circuit boards, liquid crystals, or plasma display panels etc or printed/impressed patterns, the present invention relates to a method of detecting pattern defects whereby defects are classified and detected.
2. Description of Related Art
Conventional methods of detecting pattern defects include the design rule check (DRC) method and the comparison method. The DRC method involves detecting the pattern line width and pattern separation by image processing. If the detected line width or pattern separation as respectively shown in FIG.
16
A and
FIG. 16B
is not in accordance with certain wiring or pattern rules, such is determined as a pattern defect. In the example shown in
FIGS. 16A and 16B
, the line width and the pattern separation are both smaller than predetermined values, and therefore are detected as failures. The comparison method involves comparing a subject image S that is input with the previously registered image of a good product G, and detecting the difference of these as a defect pattern D, as shown in FIG.
17
.
However, with the DRC method, as long as the detected line width or pattern separation satisfies certain rules, the pattern is determined normal. For example, in such a case as shown in
FIGS. 18A and 18B
, a bridge or a slit in the pattern cannot be detected as defects. On the other hand, normal patterns may be detected as failures if they contravene the pattern rules. For example, the separation P shown in
FIG. 19A
or the line width Q shown in
FIG. 19B
may be detected as a pattern defect.
With the comparison method, minute differences between the subject image and the registered image of a good product cannot be distinguished from noise etc, and so minute defects cannot be detected. Moreover, crucial defects such as a bridge D
2
shown in
FIG. 20
cannot be differentiated from permissible defects such as protuberance D
1
shown in FIG.
20
.
SUMMARY OF THE INVENTION
In view of the above, an object of the present invention is to provide a method of detecting pattern defects that is capable of classifying and reliably detecting various pattern defects.
A method of detecting pattern defects according to the resent invention involves comparing an input subject pattern with a good product pattern that is registered beforehand, in which a different portion of the good product pattern and subject pattern is detected as a defect pattern, and the defect pattern is classified and detected in accordance with the features of the contour of the defect pattern. Pattern defects of various types such as for example bridges, breaks, residual patterns, missing patterns, projection/protrusion, nicks/intrusion etc can reliably be detected and classified.
REFERENCES:
patent: 4496971 (1985-01-01), West et al.
patent: 4550434 (1985-10-01), Shimada et al.
patent: 4692943 (1987-09-01), Pietzsch et al.
patent: 4707734 (1987-11-01), Labinger et al.
patent: 4860371 (1989-08-01), Matsuyama et al.
patent: 5046109 (1991-09-01), Fujimori et al.
patent: 5272763 (1993-12-01), Maruyama et al.
patent: 5301248 (1994-04-01), Takanori et al.
patent: 5309108 (1994-05-01), Maeda et al.
patent: 5574800 (1996-11-01), Inoue et al.
patent: 5694481 (1997-12-01), Lam et al.
patent: 5912984 (1999-06-01), Michael et al.
patent: 5930382 (1999-07-01), Irie et al.
patent: 6427024 (2002-07-01), Bishop
patent: 6539106 (2003-03-01), Gallarda et al.
patent: 6608922 (2003-08-01), Matsushita
patent: 62131391 (1987-06-01), None
Wakitani Koichi
Yukawa Noriaki
Hesseltine Ryan J.
Jordan and Hamburg LLP
Matsushita Electric - Industrial Co., Ltd.
Wu Jingge
LandOfFree
Method of detecting pattern defects does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of detecting pattern defects, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of detecting pattern defects will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3238767