Method of detecting particles of semiconductor wafers

Details Method of detecting particles of semiconductor wafers Method of detecting particles of semiconductor wafers

1995-06-05

1997-05-27

Chilcot, Richard

Measuring and testing

Surface and cutting edge testing

Roughness

250306, 250307, H01J 3700

Patent

active

056334559

ABSTRACT:
A device for detecting the presence of particles and irregularities on the surface of a semiconductor wafer or other substrate includes a plurality of cantilevers formed on a semiconductor substrate and a means of detecting the deflection of each of the cantilevers. The cantilevers may, for example, be formed in rows and separated by selected distances. The entire substrate is then scanned over the surface to be examined, in a raster pattern, for example, and the deflection of the individual cantilevers is monitored.

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