Method of detecting microscopic defects existing on a...

Chemistry: analytical and immunological testing – Process or composition for determination of physical state... – Surface area – porosity – imperfection – or alteration

Reexamination Certificate

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C073S105000, C250S307000, C250S311000

Reexamination Certificate

active

06174727

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a method of detecting microscopic defects existing on a silicon wafer, and especially relates to a method of detecting microscopic defects existing on a silicon wafer which is effective to sensitively detect microscopic defects existing on a silicon wafer.
2. Description of the Prior Art
As the design rule of the integrated semiconductor devices shrinks smaller and smaller, it is required to further minimize the defects at the silicon wafer surfaces, such as pits, scratches, precipitation or deposition of organic, inorganic, and metal particles, especially the ones with sub &mgr;m scale.
In order to achieve the above requirement, consideration to the detailed characterization of these defects is desired. Currently, the “particle counters” which employ light scattering method are widely used among silicon wafer manufacturing factories and semiconductor device manufacturing factories to detect these defects.
However, the resolution limits of the “particle counters” are some 100 nm or larger and further smaller defects, which potentially cause serious degradation of the yield for the next generation devices with further smaller design scale, cannot be detected.
There are other techniques to detect these microscopic defects or deposited species, such as the one using radio isotope methods. However, these techniques require complicated preparation procedure and special expensive set-ups.
SUMMARY OF THE INVENTION
An object of this invention is to provide a method of detecting microscopic defects existing on a silicon wafer which is effective to sensitively detect microscopic defects existing on a silicon wafer.
The feature of this invention, which achieves the above object, is selectively depositing metals on microscopic defects existing on a silicon wafer. By depositing the metals on the microscopic defects, these defects are selectively decorated and can be easily detected by the conventional methods such as “particle counters”.


REFERENCES:
patent: 4172224 (1979-10-01), Lapinski et al.
patent: 5242831 (1993-09-01), Oki
patent: 5602329 (1997-02-01), Haubensak
patent: 6087179 (2000-07-01), Beriozkina et al.
patent: 6097484 (2000-08-01), McIntosh et al.

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