Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
Reexamination Certificate
2007-12-11
2007-12-11
Stafira, Michael P. (Department: 2886)
Optics: measuring and testing
Inspection of flaws or impurities
Surface condition
C356S237500
Reexamination Certificate
active
10693603
ABSTRACT:
A method of detecting mask defects in which a reference substrate is patterned by the mask immediately after manufacture of the mask is disclosed. The reference substrate is stored in clean conditions while IC manufacture takes place. When a mask defect is suspected, a resist coated substrate, the test substrate, is patterned by exposure of the mask. The patterns on the reference substrate and the test substrate are compared to determine if there is a mask defect. The location of the mask defect can be found by scanning smaller areas of the patterns.
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Mud Auke Jan
Van Der Werf Jan Evert
ASML Netherlands B.V.
Pillsbury Winthrop Shaw & Pittman LLP
Stafira Michael P.
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