Method of detecting defects in semiconductor package leads

Details Method of detecting defects in semiconductor package leads Method of detecting defects in semiconductor package leads

1993-08-02

1995-09-19

Mancuso, Joseph

Image analysis

Applications

Manufacturing or product inspection

382205, G06K 900, G06K 956

Patent

active

054523680

ABSTRACT:
A method of detecting defects (14, 16, 17, 44, 47, 49, and 51) in objects is presented. A first grey level image (18) of a first object (10) is formed and a second grey level image (19) of a second object (12) is formed. The first (18) and second (19) grey level images are converted to a first (21) and a second (22) edge feature image, respectively. The first edge feature image is dilated (26) and the second edge feature image is skeletonized (27). The dilated (26) and skeletonized images (27) are compared. An alternate method includes forming a grey level image (40) of an object. A principal axis of the grey level image is identified, and a shifted grey level image is formed by shifting the grey level image a distance along the principal axis. The grey level image (40) is then compared to the shifted grey level image.

REFERENCES:
patent: 4589140 (1986-05-01), Bishop et al.
patent: 4654583 (1987-03-01), Ninomiya et al.
patent: 4692943 (1987-09-01), Pietzsch et al.
patent: 4975972 (1990-12-01), Bose et al.
patent: 5115475 (1992-05-01), LeBeau
patent: 5119434 (1992-06-01), Bishop et al.
patent: 5129009 (1992-07-01), LeBeau
patent: 5144681 (1992-09-01), Kitakado et al.
patent: 5172420 (1992-12-01), Ray et al.
patent: 5204910 (1993-04-01), LeBeau
patent: 5253306 (1993-10-01), Nishio
Gonzalez et al, Digital Image Processing, Addison-Wesley Pub. 1992, pp. 491-495.
Petros Maragos, "Tutorial On Advances In Morphological Image Processing And Analysis", Optical Engineering vol. 26, No. 7, Jul. 1987, pp. 623-632.
"Handbook of Pattern Recognition and Image Processing", Ed. Tsay Young et al, Academic Press, San Diego, 1986, pp. 262-264.
Rafael Gonzalez et al, "Digital Image Processing", Addison-Wesley, 1987, pp. 334-340.

Affiliated with

Also associated with

Rating

Method of detecting defects in semiconductor package leads does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of detecting defects in semiconductor package leads, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of detecting defects in semiconductor package leads will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1834801