Method of designing and manufacturing circuits using universal c

Details Method of designing and manufacturing circuits using universal c Method of designing and manufacturing circuits using universal c

1986-12-23

1988-12-20

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

174 685, 361412, H01K 310

Patent

active

047917229

ABSTRACT:
A printed circuit for mounting and connecting a plurality of semiconductor devices is disclosed and includes a planar insulating substrate having multiple conductive layers disposed in overlying relationship within the planar substrate. A plurality of parallel rows of apertures for wire wrap, quick connect or stitch wire contacts are provided for mounting integrated circuit. One side of the printed circuit board includes a plurality of power and ground connections disposed between each pair of parallel rows of apertures so that filter capacitors may be mounted under each integrated circuit, thereby conserving printed circuit board space. In a preferred mode of the present invention, alternate ones of the conductive layers are coupled to a source of electrical power while all remaining conductive layers are gounded. At least two adjacent conductive layers are then utilized to minimize parasitic capacitance by completely surrounding each aperture with a portion of conductive material.

REFERENCES:
patent: 3205469 (1965-09-01), Frank et al.
patent: 3644792 (1972-02-01), Fields
patent: 3917984 (1975-11-01), Kong et al.
patent: 4129349 (1978-12-01), Von Roesgen
patent: 4387509 (1983-06-01), Dechelette
patent: 4461061 (1984-07-01), Rock

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