Method of depositing thin films utilizing a polyimide mask

Details Method of depositing thin films utilizing a polyimide mask Method of depositing thin films utilizing a polyimide mask

1976-12-30

1978-05-30

Newsome, John H.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

156643, 156659, 156661, 427 43, 96 351, 96 362, B05D 306

Patent

active

040924424

ABSTRACT:
A polyimide mask is used as an undercoat for a standard resist material during the patterning of an underlying thin film layer by plasma etching. The polyimide mask can withstand the conditions of reactive ion (plasma) etching so that it can be used as a protective coating when the thin film is subtractively etched by the plasma etching. The polyimide is particularly useful in processes using either positive or negative electron beam lithography which require sensitive resists.

REFERENCES:
patent: 3700497 (1972-10-01), Epifano et al.
patent: 3705055 (1972-12-01), Christensen et al.
patent: 3767490 (1973-10-01), Alberts
patent: 3853813 (1974-12-01), Edelman et al.
patent: 3914127 (1975-10-01), Buss et al.
patent: 4004044 (1977-01-01), Franco et al.

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