Method of depositing or repairing a patterned metal layer on a s

Details Method of depositing or repairing a patterned metal layer on a s Method of depositing or repairing a patterned metal layer on a s

1976-10-15

1978-08-15

Lusignan, Michael R.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

96 362, 96 383, 427304, 427305, 427437, 427438, 29401R, C23F 102, C23F 1700

Patent

active

041073517

ABSTRACT:
In a wholly additive process for depositing a patterned metal layer on an insulating substrate, the sensitized and activated substrate is coated with photoresist; a desired pattern is formed in the photoresist layer by exposing it to a mask and developing it using conventional techniques; the patterned surface is then contacted with a second developer solution containing the activator; a metal pattern is deposited by electroless metal plating; and the photoresist is removed.

REFERENCES:
patent: 3615471 (1971-10-01), Lenoble et al.
patent: 3753816 (1973-08-01), Feldstein et al.
patent: 3779758 (1973-12-01), Polichette
patent: 3833375 (1974-09-01), Moscong et al.
patent: 3945826 (1976-03-01), Friedman et al.
patent: 3960561 (1976-06-01), Haining et al.

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