Method of depositing material into high aspect ratio features

Details Method of depositing material into high aspect ratio features Method of depositing material into high aspect ratio features

2005-09-27

2005-09-27

Kim, Paul D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S603130, C029S603140, C029S606000, C216S062000, C216S065000, C216S066000, C360S122000, C360S125330, C360S317000, C427S127000, C427S128000, C451S005000, C451S041000

Reexamination Certificate

active

06948231

ABSTRACT:
The present invention presents a method for fabricating coil elements for magnetic write heads. A coil pattern is formed on a substrate using photolithographic techniques. The substrate is etched using reactive ion etching, creating a coil-shaped trench in the substrate. Thin film seed layers are deposited using ion beam deposition. The substrate is electroplated with metal filling the trenches with metal. The substrate is chemical mechanical polished to remove excess metal and planarize the air bearing surface of the write head.

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“Time domain network analysis of write head coil impedance”; Dakroub, H.; Magnetics, IEEE Transactions on , vol.: 37 , Issue: 2 , Mar. 2001; pp.: 1049-1051.
Broadbent et al., “Experimental and Analytical Study of Seed Layer Resistance for Copper Damascene Electroplating,” J. Vac. Sci. Technol. B 17(6) Nov./Dec. 1999, pp. 2584-2595.

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