Method of depositing conductive lines on a dielectric

Details Method of depositing conductive lines on a dielectric Method of depositing conductive lines on a dielectric

1992-11-13

1993-10-05

Padgett, Marianne

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

427553, 427584, 427250, 427253, 156634, 156656, 20419214, 20419217, B05D 306, C23C 1600, C23C 1400, H01L 21306

Patent

active

052503291

ABSTRACT:
A method of depositing micron-sized metal lines on a dielectric substrate, such as polyimide. The dielectric is covered with a thin metallic layer, of a first metal placed in a reaction cell containing a gas-phase molecular species containing a second metal, and exposed to a focused laser beam. A translation stage moves the dielectric relative to the beam to selectively deposit micron-sized second metal lines on the metallic layer. The metallic layer on the unirradiated portion of the substrate is subsequently etched away, leaving the lines adhered to the dielectric surface.

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