Method of depositing a metal on a surface

Chemistry: electrical and wave energy – Processes and products

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Details

427 98, 427304, 204 38B, C23C 302, C23B 564

Patent

active

041000374

ABSTRACT:
A method of depositing a metal on a surface of a substrate is disclosed. The method comprises selectively coating portions of the surface with a colloidophobic material to render the portions colloidophobic and to delineate an exposed surface pattern which is capable of retaining a colloidal species thereon. The selectively coated surface is treated with a sol comprising a colloidal species selected from the group comprising (1) a species capable of reducing an activating metal ion to an activating metal, and (2) a colloidal activating metal species capable of participating in an electroless metal deposition to deposit the colloidal species on the exposed surface pattern.

REFERENCES:
patent: 2441960 (1948-05-01), Eisler
patent: 3011920 (1961-12-01), Shipley
patent: 3532518 (1970-10-01), D'Ottavio
patent: 3627724 (1971-12-01), Lambert
patent: 3632435 (1972-01-01), Eriksson
patent: 3640765 (1972-02-01), DiStefano
patent: 3657003 (1972-04-01), Klancy
patent: 3760091 (1973-09-01), Cannizzaro et al.
patent: 3764280 (1972-10-01), Lupinski
patent: 3775117 (1973-11-01), Hoffman
patent: 3791939 (1974-02-01), Ferrara
patent: 3793072 (1974-02-01), Lando
patent: 3841881 (1974-10-01), Feldstein
Feldstein, Plating, Aug. 1970, pp. 1, 2.
Process Instructions, CuPosit Products, pg (PI54-55), 1962.

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