Method of depositing a metal from an electroless plating solutio

Details Method of depositing a metal from an electroless plating solutio Method of depositing a metal from an electroless plating solutio

1983-12-19

1987-03-24

Chapman, Terryence

Chemistry: electrical and wave energy

Processes and products

204 20, 204 47, 204 49, 204 451, 204 521, 204 541, C25D 302, C25D 312, C25D 330, C25D 352

Patent

active

046523456

ABSTRACT:
A metal is deposited onto a substrate from an electroless plating solution by providing a first body which comprises the substrate in a plating solution, providing a second body in the plating solution wherein the second body includes a metal which has an electrolytic potential in the plating solution which is different from that of the metal to be plated, and electrically connecting the first body with the second body with an electrically conductive circuit.

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