Method of deforming a biaxially textured buffer layer on a textu

Details Method of deforming a biaxially textured buffer layer on a textu Method of deforming a biaxially textured buffer layer on a textu

1998-09-30

2000-09-05

Kunemund, Robert

Superconductor technology: apparatus, material, process

Processes of producing or treating high temperature...

Coating

505474, 505236, 117 95, 117101, 117106, 117947, C30B 2922

Patent

active

061142875

ABSTRACT:
The present invention provides methods and biaxially textured articles having a deformed epitaxial layer formed therefrom for use with high temperature superconductors, photovoltaic, ferroelectric, or optical devices. A buffer layer is epitaxially deposited onto biaxially-textured substrates and then mechanically deformed. The deformation process minimizes or eliminates grooves, or other irregularities, formed on the buffer layer while maintaining the biaxial texture of the buffer layer. Advantageously, the biaxial texture of the buffer layer is not altered during subsequent heat treatments of the deformed buffer. The present invention provides mechanical densification procedures which can be incorporated into the processing of superconducting films through the powder deposit or precursor approaches without incurring unfavorable high-angle grain boundaries.

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