Method of defect review

Details Method of defect review Method of defect review

2006-07-04

2006-07-04

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

C257SE21521, C438S014000

Reexamination Certificate

active

07071011

ABSTRACT:
A method of defect review. First, a wafer with a plurality of defects is provided. A defect inspection is performed to detect the defects. An automatic defect classification is then performed to divide the defects into different defect types according to a predetermined database. A defect review is performed to review different defect types of defects which are sampled in different weights according to yield killing ratios of each defect types.

REFERENCES:
patent: 6445199 (2002-09-01), Satya et al.

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