Method of cutting workpiece

Details Method of cutting workpiece Method of cutting workpiece

1990-08-23

1991-05-21

Phan, Hien H.

Severing by tearing or breaking

Methods

With preliminary weakening

225 965, 225103, C03B 3303

Patent

active

050168002

ABSTRACT:
A method for cutting workpiece made of such a glass or ceramic material having relatively large thickness. A workpiece having one surface on which an incision is previously formed is placed on a flat plate which has a Young's modulus smaller than that of the workpiece and which is placed on a surface plate, so that the surface having the incision of the workpiece faces the upper surface of the flat plate. A pressing load is then applied downwardly through a pressing member to the surface opposite to the surface having the incision of the workpiece locally along the incision. The workpiece is thus cut by the bending moment due to the difference of the Young's moduli of the workpiece and the flat plate without generating noises or forming chips.

REFERENCES:
patent: 3559855 (1971-02-01), Barnett et al.
patent: 3578227 (1971-05-01), Gehri
patent: 4106683 (1978-08-01), Gulish, Jr.
patent: 4225072 (1980-09-01), Reeves

Affiliated with

Also associated with

Rating

Method of cutting workpiece does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of cutting workpiece, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of cutting workpiece will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-231406