Method of cutting PCBS

Details Method of cutting PCBS Method of cutting PCBS

2011-05-17

2011-05-17

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C438S460000, C438S465000

Reexamination Certificate

active

07943490

ABSTRACT:
The present invention relates to a method of cutting PCB module using a laser. The method includes steps of: providing a coverlay film, the coverlay film including at least one opening defined therein; attaching the coverlay film onto the PCB module such that the through holes of the PCB module are covered by the coverlay film and the laser cutting area thereof is exposed via the at least one opening; applying a laser beam to the exposed laser cutting area of the PCB module to cut the PCB module; and removing the coverlay film. A high positioning precision of the PCB module and better cutting result can be obtained.

REFERENCES:
patent: 5609746 (1997-03-01), Farrar et al.
patent: 7742843 (2010-06-01), Licht et al.
patent: 2003/0160035 (2003-08-01), Gregory
patent: 2004/0142191 (2004-07-01), Mei-Yen et al.
patent: 2008/0026602 (2008-01-01), Wang et al.

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