Semiconductor device manufacturing: process – Semiconductor substrate dicing – By electromagnetic irradiation
Reexamination Certificate
2011-05-17
2011-05-17
Picardat, Kevin M (Department: 2822)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
By electromagnetic irradiation
C438S460000, C438S465000
Reexamination Certificate
active
07943490
ABSTRACT:
The present invention relates to a method of cutting PCB module using a laser. The method includes steps of: providing a coverlay film, the coverlay film including at least one opening defined therein; attaching the coverlay film onto the PCB module such that the through holes of the PCB module are covered by the coverlay film and the laser cutting area thereof is exposed via the at least one opening; applying a laser beam to the exposed laser cutting area of the PCB module to cut the PCB module; and removing the coverlay film. A high positioning precision of the PCB module and better cutting result can be obtained.
REFERENCES:
patent: 5609746 (1997-03-01), Farrar et al.
patent: 7742843 (2010-06-01), Licht et al.
patent: 2003/0160035 (2003-08-01), Gregory
patent: 2004/0142191 (2004-07-01), Mei-Yen et al.
patent: 2008/0026602 (2008-01-01), Wang et al.
Lin Huan-Long
Su Ying
Zhang Hu-Hai
Cheng Andrew C.
Foxconn Advanced Technology Inc.
FuKui Precision Compenent(Shenzhen) Co., Ltd.
Picardat Kevin M
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