Method of cutting out shell halves formed in a wafer sheet

Details Method of cutting out shell halves formed in a wafer sheet Method of cutting out shell halves formed in a wafer sheet

1981-12-02

1984-07-10

Meister, James M.

Cutting

Processes

Cutting wall of hollow work

83409, 834092, 83422, 834351, 83914, 426518, B26D 300

Patent

active

044585683

ABSTRACT:
The shell halves are separated from the web portion of the wafer sheet by means of a sawing operation, effected parallel to the plane of the sheet. When two halves cut out in such way are assembled to form a shell enclosing a filling, the sawn areas mate each other so that they are hidden from sight. This invention has application to the manufacture of candy of the type having a shell and a filling.

REFERENCES:
patent: 454931 (1891-06-01), Heinsdorf
patent: 1118610 (1914-11-01), Winchester
patent: 1448472 (1923-03-01), Thompson
patent: 3093021 (1963-06-01), Barron
patent: 4002091 (1977-01-01), White
patent: 4211131 (1980-07-01), Fenn et al.
patent: 4300423 (1981-11-01), Price

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