Cutting – Processes – With subsequent handling
Patent
1977-02-18
1977-11-29
Meister, J. M.
Cutting
Processes
With subsequent handling
83 31, 83167, 83542, 83547, B26D 706, B26D 508
Patent
active
040600173
ABSTRACT:
A method for cutting lithium metal into a plurality of pieces, and a device for accomplishing the method, are disclosed, comprising the steps of positioning a quantity of lithium metal at a predetermined position between an anvil means and a cutting means which are positioned in operating relationship with each other. A thin flexible film, preferably a plastic, is interposed between the blade and the lithium such that when the blade is forced against the anvil with sufficient force to cut the lithium, the film prevents contact of the blade with the lithium. Indexing of the lithium and the film after each cut permits repetitive cutting to provide a plurality of pieces from the lithium metal stock.
REFERENCES:
patent: 2127960 (1938-08-01), Piazze
Honeywell Inc.
Meister J. M.
Munday John S.
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