Method of cutting hollow filaments embedded in resinous mass

Details Method of cutting hollow filaments embedded in resinous mass Method of cutting hollow filaments embedded in resinous mass

1977-11-30

1980-01-15

Derrington, James H.

Plastic and nonmetallic article shaping or treating: processes

With severing, removing material from preform mechanically,...

Removing surface portion of composite workpiece to expose...

156296, 264118, 264128, 264138, 264159, 427293, B32B 3100

Patent

active

041838904

ABSTRACT:
Hollow filaments, which are suitable for use in separating one or more components from a fluid mixture by selective permeation, are embedded, or potted, in a curable resinous mass, and the resinous mass is severed to expose fluid communication openings of the hollow filaments. In accordance with the invention the curable resinous mass is sufficiently partially-cured to provide a solid mass which can be severed but does not tend to smear when severed so as to obstruct fluid communication openings of the hollow filaments; however, the partial curing is insufficient to render the severings of the resinous mass unduly difficult. The resinous mass is then severed, e.g., by cutting, to provide the fluid communication openings in the hollow filaments embedded in the resinous mass. Advantageously, the fluid communication openings of substantially all of the filaments exposed by severing the resinous mass can be essentially unobstructed, and the integrity of the filaments and the resinous mass is substantially maintained during severing. The curing of the resinous mass can be completed after severing to provide a sealing means which has high structural strength.

REFERENCES:
patent: 3423491 (1969-01-01), McLain et al.
patent: 3503228 (1970-03-01), Swartling

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