Method of cutting electrical fuse

Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to nonconductive state

Reexamination Certificate

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Details

C438S215000, C438S228000, C438S333000, C438S467000, C438S601000, C257S529000, C257S209000, C257SE21592, C257SE23149

Reexamination Certificate

active

07998798

ABSTRACT:
A method of cutting an electrical fuse including a first conductor and a second conductor, the first conductor including a first cutting target region, the second conductor branched from the first conductor and connected to the first conductor and including a second cutting target region, which are formed on a semiconductor substrate, the method includes flowing a current in the first conductor, causing material of the first conductor to flow outward near a coupling portion connecting the first conductor to the second conductor, and cutting the first cutting target region and the second cutting target region.

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