Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to nonconductive state
Reexamination Certificate
2011-08-16
2011-08-16
Gurley, Lynne A (Department: 2811)
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
Using structure alterable to nonconductive state
C438S215000, C438S228000, C438S333000, C438S467000, C438S601000, C257S529000, C257S209000, C257SE21592, C257SE23149
Reexamination Certificate
active
07998798
ABSTRACT:
A method of cutting an electrical fuse including a first conductor and a second conductor, the first conductor including a first cutting target region, the second conductor branched from the first conductor and connected to the first conductor and including a second cutting target region, which are formed on a semiconductor substrate, the method includes flowing a current in the first conductor, causing material of the first conductor to flow outward near a coupling portion connecting the first conductor to the second conductor, and cutting the first cutting target region and the second cutting target region.
REFERENCES:
patent: 4064493 (1977-12-01), Davis
patent: 6362514 (2002-03-01), Ido et al.
patent: 6381115 (2002-04-01), Chan et al.
patent: 2001/0017755 (2001-08-01), Toyoshima
patent: 2003/0155629 (2003-08-01), Giust et al.
patent: 2004/0159906 (2004-08-01), Hashimoto
patent: 2004/0224444 (2004-11-01), Hisaka
patent: 2004/0262710 (2004-12-01), Ueda
patent: 2005/0029620 (2005-02-01), Ueda
patent: 2005/0285222 (2005-12-01), Thei et al.
patent: 2006/0054993 (2006-03-01), Fukuda
patent: 2006/0267721 (2006-11-01), Graf et al.
patent: 2007/0007621 (2007-01-01), Omura et al.
patent: 2007/0090486 (2007-04-01), Otsuka et al.
patent: 2007/0217251 (2007-09-01), Chen et al.
patent: 2007/0222497 (2007-09-01), Barwin et al.
patent: 2004-214580 (2004-07-01), None
patent: 2005-039220 (2005-02-01), None
patent: 2005-057186 (2005-03-01), None
Gebreyesus Yosef
Gurley Lynne A
Renesas Electronics Corporation
Young & Thompson
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