Method of cutting an object and of further processing the...

Details Method of cutting an object and of further processing the... Method of cutting an object and of further processing the...

2007-01-16

2007-01-16

Tsai, H. Jey (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S463000, C438S464000, C257SE21600

Reexamination Certificate

active

10240791

ABSTRACT:
The invention relates to an object (1) that is cut by means of a laser and a water beam and to further processing of the cut material. The object is glued on a carrier (3) that is provided with an adhesive and can be transparent for the radiation used in the water beam (7). The carrier can be a solid body and preferably a fibrous mat (3). Said body or mat is penetrated by the water beam. The object (1) or the cut material thereof is held on the carrier (3) before, during and after cutting through in such a way that said object or material does not change position. In a preferred embodiment, a silicon wafer is used as the object because of the high cutting exactness to be obtained. Other materials can also be used.

REFERENCES:
patent: 5543365 (1996-08-01), Wills et al.
patent: 5691248 (1997-11-01), Cronin et al.
patent: 5877064 (1999-03-01), Chang et al.
patent: 6407360 (2002-06-01), Choo et al.
patent: 6524881 (2003-02-01), Tandy et al.
patent: 61-121837 (1986-06-01), None
patent: 63-036988 (1988-02-01), None
patent: 07-074131 (1995-03-01), None
patent: 07-283249 (1995-10-01), None
patent: 2001-316648 (2001-11-01), None
patent: 95/32834 (1995-12-01), None
patent: 99/56907 (1999-11-01), None

Affiliated with

Also associated with

Rating

Method of cutting an object and of further processing the... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of cutting an object and of further processing the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of cutting an object and of further processing the... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3815224