Method of cutting a workpiece with a wire saw

Details Method of cutting a workpiece with a wire saw Method of cutting a workpiece with a wire saw

1997-03-20

1999-08-03

Eley, Timothy V.

Stone working

Sawing

Reciprocating

125 21, B28D 106

Patent

active

059311479

ABSTRACT:
There is disclosed a method of slicing a semiconductor ingot in which the ingot is pressed against a moving wire. A thinner portion of the wire is used at the beginning of slicing to cut a portion of the ingot where the cutting length is shorter than a predetermined length, and a thicker portion of the wire is used when the cutting length becomes longer than the predetermined length. Subsequently, a thinner portion of the wire is used when the slicing approaches to the end and the cutting length becomes shorter than a predetermined length. A portion of the wire used in previous slicing is used as the thinner portion. Alternatively, the thinner portion is formed through use of a die. The slicing method makes it possible to cut the ingot into a plurality of wafers having a uniform thickness.

REFERENCES:
patent: 2385287 (1945-09-01), Le Van
patent: 3395204 (1968-07-01), Olsson et al.

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