Method of curing inaccessible thermoset adhesive joints using ra

Details Method of curing inaccessible thermoset adhesive joints using ra Method of curing inaccessible thermoset adhesive joints using ra

1995-10-06

1998-01-27

Leung, Philip H.

Electric heating

Capacitive dielectric heating

Bonding

219634, 219770, 219780, 1562744, 1563802, H05B 662

Patent

active

057124698

ABSTRACT:
Method of curing inaccessible thermoset adhesive joints, comprising: forming structures to be bonded at mating surfaces when assembled, the shortest distance from the mating surfaces to the exterior of the assembly inhibiting the application of radio frequency heating by exterior electrodes; while forming the structures, molding into a least one of the structures, spaced from the surfaces to be adhered, a fiber or film-like electrode of sufficient thickness and spacing to project radio frequency waves through such one structure to the adhesive when energized; assembling the surfaces together with a thermoset adhesive therebetween in intimate contact of each of the surfaces; and connecting the fibrous or thin filmed electrode in a circuit for passing radio frequency waves across the adhesive to effect dielectric heating of the adhesive for a controlled period of time and at a predetermined temperature rise for curing.

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