Method of cross-section milling with focused ion beam (FIB)...

Details Method of cross-section milling with focused ion beam (FIB)... Method of cross-section milling with focused ion beam (FIB)...

2005-06-16

2008-09-23

Berman, Jack (Department: 2881)

Radiant energy

Methods including separation or nonradiant treatment of test...

C250S310000, C250S306000, C250S307000, C250S309000, C250S492100, C250S492210, C250S492300, C438S460000, C438S024000, C438S014000, C438S016000

Reexamination Certificate

active

07427753

ABSTRACT:
A method of milling a cross section of a wafer and a milling device. The method includes a coarse scanning of at least two milling frames and a fine scanning of at least one milling frame. The milling device is adapted to cross-section milling of a wafer, said milling includes a coarse scanning of at least two milling frames and a fine scanning of at least one milling frame.

REFERENCES:
patent: 5093572 (1992-03-01), Hosona
patent: 6211527 (2001-04-01), Chandler
patent: 6641705 (2003-11-01), Phaneuf
patent: 6670610 (2003-12-01), Shemesh
patent: 6768110 (2004-07-01), Alani

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