Metal working – Method of mechanical manufacture – Electrical device making
Patent
1987-08-31
1989-05-09
Eley, Timothy V.
Metal working
Method of mechanical manufacture
Electrical device making
29829, 228118, 427 96, H05K 300, H05K 342
Patent
active
048276103
ABSTRACT:
A method of preparing a substrate such as a semiconductor chip or ceramic thin film having vias for soldering to a substrate requires that a first metal that is resistive to solder bonding be deposited on the backside of the semiconductor device. The deposited metal is removed from the surface of the semiconductor device, leaving the vias of the semiconductor device having the first metal deposited through them. This technique is useful in any requirement requiring a solder or brazing barrier. That is a photolithographic process in conjunction with a refractory or nonsolderable metal deposit is used to achieve an alloy or solder barrier.
REFERENCES:
patent: 4360968 (1982-11-01), D'Amico et al.
patent: 4544577 (1985-10-01), May
Barnett Larry G.
Bedinger John
Rhine David B.
Williams Ralph E.
Eley Timothy V.
Grossman Rene E.
Romano Ferdinand M.
Ross Taylor J.
Sharp Melvin
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