Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-07-12
2008-08-12
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S456000
Reexamination Certificate
active
07410828
ABSTRACT:
A method of creating a predefined internal pressure within a cavity of a semiconductor device, the method including providing the semiconductor device, the semiconductor device including a semiconductor oxide area which is continuously arranged between the cavity of the semiconductor device and an external surface of the semiconductor device, exposing the semiconductor device to an ambient atmosphere with a noble gas at a first temperature for a predetermined time period, and setting a second temperature, which is different from the first, after the predetermined time period has expired, the semiconductor oxide area exhibiting a higher permeability for the noble gas at the first temperature than at the second temperature.
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Merz Peter
Oldsen Marten
Quenzer Hans Joachim
Reinert Wolfgang
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung
Geyer Scott B.
Glenn Michael A.
Glenn Patent Group
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