Method of covering substrate surface with sintered layer and pow

Details Method of covering substrate surface with sintered layer and pow Method of covering substrate surface with sintered layer and pow

1991-11-26

1994-08-09

Kastler, Scott

Coating processes

With post-treatment of coating or coating material

Solid treating member or material contacts coating

264125, 419 8, B05D 312

Patent

active

053365275

ABSTRACT:
A method of covering a substrate surface with a sintered layer comprises the step of loading a powdery raw material in a region of forming a sintered layer on the surface of a substrate, and the step of sintering the loaded powdery raw material so as to form a sintered layer on the surface of the substrate. The powdery raw material contains at least two elements and has a temperature region in which a solid phase and a liquid phase are present together. The liquid phase is wettable with the substrate. The sintering step is performed within a temperature region in which the solid phase and the liquid phase of the powdery raw material are present together.

REFERENCES:
patent: 3475161 (1969-10-01), Ramirez et al.
patent: 4039700 (1977-08-01), Sohmer et al.
patent: 4102678 (1978-07-01), Gothard et al.
patent: 4750667 (1988-06-01), Takahashi et al.
patent: 4851267 (1989-07-01), Miyauchi et al.

Affiliated with

Also associated with

Rating

Method of covering substrate surface with sintered layer and pow does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of covering substrate surface with sintered layer and pow, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of covering substrate surface with sintered layer and pow will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-215047