Method of coupling and forming copper fittings with solder there

Details Method of coupling and forming copper fittings with solder there Method of coupling and forming copper fittings with solder there

1995-09-05

1998-11-24

Bradley, P. Austin

Metal fusion bonding

Process

With shaping

228169, 228254, 72370, B23K 120, B23K 3102, B21B 1702

Patent

active

058396446

ABSTRACT:
An improved fluid fitting made from a portion of copper tubing has at least one annular cavity disposed in its inner periphery adjacent to each open end of the fitting. Solder is disposed in and substantially fills the at least one annular without extending beyond the inner periphery of the fitting. The fitting is fabricated by being placed in a die having a hollow with at least one annular depression. A first mandrel is placed into the fitting, with annular cavity forming ball members in substantial alignment with the at least annular depression of the hollow. The ball members are used to form the at least one annular cavity in the inner periphery of the fitting. A second mandrel has an aperture that substantially aligns with the at least one formed annular cavity and molten solder is injected into the at least one annular cavity through the second mandrel, to substantially fill the at least one annular cavity. The second mandrel forms an interference fit with the inner periphery of the fitting to remove any excess solder protruding from the at least one annular cavity into the inner periphery of the fitting as the mandrel is removed from the fitting.

REFERENCES:
patent: 465957 (1891-12-01), Willmott
patent: 568574 (1896-09-01), Hoyer
patent: 2084207 (1937-06-01), Lindquist
patent: 2120067 (1938-06-01), Gray et al.
patent: 3419953 (1969-01-01), Deimen

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