Method of coupling a surface mount device

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S840000, C029S841000, C029S842000, C029S854000, C029S855000, C174S260000, C228S044700, C228S180210, C228S180220, C257S726000, C257S727000, C257S737000, C257S738000, C257S778000, C438S108000, C438S612000, C438S613000

Reexamination Certificate

active

07603769

ABSTRACT:
Methods of coupling a surface mount device with a substrate such as a printed circuit, for example, are disclosed. A method, according to one aspect, may include coupling a holder with a substrate such that terminals of the substrate are included in an opening of the holder, mounting an electronic device over the terminals with a conductive bonding material disposed there between, heating the conductive bonding material to its melting point, and cooling the conductive bonding material.

REFERENCES:
patent: 6020645 (2000-02-01), Ooyabu
patent: 6509530 (2003-01-01), Pearson et al.
patent: 6566611 (2003-05-01), Kochanowski et al.
patent: 6687983 (2004-02-01), Seng
patent: 6744126 (2004-06-01), Chiang
patent: 6812565 (2004-11-01), Nishimoto et al.
patent: 2004/0169275 (2004-09-01), Danvir et al.

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