Method of coupling a surface mount device

Details Method of coupling a surface mount device Method of coupling a surface mount device

2007-09-14

2009-10-20

Kim, Paul D (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S840000, C029S841000, C029S842000, C029S854000, C029S855000, C174S260000, C228S044700, C228S180210, C228S180220, C257S726000, C257S727000, C257S737000, C257S738000, C257S778000, C438S108000, C438S612000, C438S613000

Reexamination Certificate

active

07603769

ABSTRACT:
Methods of coupling a surface mount device with a substrate such as a printed circuit, for example, are disclosed. A method, according to one aspect, may include coupling a holder with a substrate such that terminals of the substrate are included in an opening of the holder, mounting an electronic device over the terminals with a conductive bonding material disposed there between, heating the conductive bonding material to its melting point, and cooling the conductive bonding material.

REFERENCES:
patent: 6020645 (2000-02-01), Ooyabu
patent: 6509530 (2003-01-01), Pearson et al.
patent: 6566611 (2003-05-01), Kochanowski et al.
patent: 6687983 (2004-02-01), Seng
patent: 6744126 (2004-06-01), Chiang
patent: 6812565 (2004-11-01), Nishimoto et al.
patent: 2004/0169275 (2004-09-01), Danvir et al.

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