Method of correcting pattern critical dimension of photomask

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

Reexamination Certificate

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Reexamination Certificate

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07914951

ABSTRACT:
A method of correcting a pattern critical dimension of a photomask includes forming a phase shift layer and a light blocking pattern on a substrate, measuring a critical dimension (CD) of the light blocking pattern, and forming a negative resist pattern that has a relatively smaller CD than the CD of the light blocking pattern on the light blocking pattern, and correcting the CD of the light blocking pattern by etching the light blocking pattern exposed by the negative resist pattern. The method may further include forming a phase shift pattern by etching the phase shift layer exposed by the corrected light blocking pattern and the negative resist pattern as an etch mask, and removing the negative resist pattern and the corrected light blocking pattern.

REFERENCES:
patent: 6110624 (2000-08-01), Hibbs et al.
patent: 6406818 (2002-06-01), Zemen et al.
patent: 7294440 (2007-11-01), Rankin et al.
patent: 2005/0048377 (2005-03-01), Yang
patent: 2008/0160429 (2008-07-01), Jeong
patent: 2008/0280214 (2008-11-01), Ryu
patent: 10-2006-0133419 (2006-12-01), None
patent: 10 2007 0068910 (2007-07-01), None

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