Method of correcting bonding coordinates using reference...

Details Method of correcting bonding coordinates using reference... Method of correcting bonding coordinates using reference...

2006-07-12

2010-10-19

Werner, Brian P (Department: 2624)

Image analysis

Applications

Manufacturing or product inspection

C700S121000, C228S904000

Reexamination Certificate

active

07817846

ABSTRACT:
A method of correcting bonding coordinates according to locations of a die and leads loaded for bonding is provided. The method includes searching for locations of die recognition areas and lead recognition areas, comparing the detected locations of the recognition areas, and correcting bonding coordinates of the die and the leads according to the result obtained by the comparison; and if a search for the locations of the die recognition areas fails, searching for reference bond pads, comparing locations of the detected reference bond pads with setting locations, and correcting bonding coordinates of a die and leads to be bonded according to the result obtained by the comparison.

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