Method of copper plating gravure rolls

Details Method of copper plating gravure rolls Method of copper plating gravure rolls

1987-02-03

1988-11-01

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 521, C25D 700

Patent

active

047818018

ABSTRACT:
A method of electropolating a layer of copper on gravure rolls is provided with the so-plated layer being especially adapted to receive electronic engraving. The method comprises the steps of placing a gravure roll in an electroplating bath comprising from about 150 to about 225 g/l of copper sulfate as pentahydrate, from about 35 to about 90 g/l of sulfuric acid, from about 0.01 to about 1.0 g/l of a polyether surfactant having a molecular weight of from about 400 to about 10,000, from about 1 to about 100 mg/l of a sulfonated, sulfurized benzene brightener compound, and about 0.5 to about 5 mg/l of a grain refining compound having the nucleus ##STR1## in a heterocyclic ring structure, and a molecular weight between about 100 and about 180.

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