Method of copper plating gravure cylinders

Details Method of copper plating gravure cylinders Method of copper plating gravure cylinders

1981-05-19

1982-06-15

Tufariello, T.

Chemistry: electrical and wave energy

Processes and products

204 52R, C25D 338, C25D 700

Patent

active

043349668

ABSTRACT:
A method is provided for depositing on a gravure roll a layer of copper especially adapted to receive electronic engraving comprising the steps of placing a gravure roll in an electroplating bath comprising from about 150 to about 225 grams/liter of copper sulfate from about 35 to about 90 grams/liter of sulfuric acid, from about 1 to about 15 grams/liter of a polyether having a molecular weight from about 4,000 to about 10,000, from about 0.3 to about 3.0 milligrams/liter of 1-lower alkyl-2-mercapto imidazole, and from about 1 to about 100 milligrams/liter of a sulfonated, sulfurized benzene compound; and passing electrical current through the bath to deposit copper on said roll.

REFERENCES:
patent: 2127824 (1938-08-01), Leuchter
patent: 2424887 (1947-07-01), Henricks
patent: 3328273 (1967-06-01), Creutz

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