Method of copper plating

Details Method of copper plating Method of copper plating

1991-06-18

1992-09-01

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

204275, 205125, 205292, 205920, C25D 338, C25D 554, C25D 2114

Patent

active

051435934

ABSTRACT:
A method of copper-plating a material whereby electrolysis is performed using an electrolytic plating cell including a diaphragm which separates an anode chamber having therein an insoluble metal electrode as an anode from a cathode chamber having therein the material to be plated as a cathode, and further using an electrolyte solution containing copper ions and an additive, wherein the electrolyte is fed to the cathode chamber in a manner such that the copper ion concentration in the electrolyte within the cathode chamber is kept constant and electrolyte is further fed to the anode chamber at a rate of from about 0.2 to 11 ml/KAh.

REFERENCES:
patent: 3769179 (1973-10-01), Durose et al.
patent: 4469564 (1984-09-01), Okinaka et al.
patent: 4518465 (1985-05-01), Morimoto et al.
Chemical Abstracts, vol. 85, No. 26, 1976, p. 446; abstract No. 184092r.

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