Method of copper deposition from a supercritical fluid...

Coating processes – Immersion or partial immersion

Reexamination Certificate

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C427S250000, C427S314000

Reexamination Certificate

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07550179

ABSTRACT:
Methods of depositing a copper film onto the surface of a substrate from a supercritical solution containing copper-containing precursors having monoanionic bidentate and neutral monodentate ligands, which comprise contacting the substrate with the solution; heating the substrate to a temperature between about 60° C. and less than 150° C.; and forming a copper-containing film on at least a portion of the substrate surface. Also provided are copper-containing precursor compositions used therein.

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X. Ye et. al., Making Nanomaterials in Supercritical Fluids: A Review, J. Chem. Ed., 2003, pp. 198 and 201-203, vol. 80.
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