Method of cooling semiconductor die using microchannel...

Details Method of cooling semiconductor die using microchannel... Method of cooling semiconductor die using microchannel...

2006-02-21

2006-02-21

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C165S104330, C257S715000, C174S015100

Reexamination Certificate

active

07002801

ABSTRACT:
The invention provides for cooling a semiconductor die. The die has plurality of micro-channels. A condenser is in fluid communication with the micro-channels such that the die heats vaporizes fluid at the die to force fluid towards the condenser, and such that gravity pressurizes cooler condenser fluid towards the die. A semiconductor plate such as glass may couple with the die to seal the micro-channels and to form a plurality of fluid conduits for the fluid. Generally, the fluid is alcohol. A first fluid conduit and a second fluid conduit couple between the die's micro-channels and the condenser to form a closed loop thermosyphon system. The condenser is preferably constructed and arranged above the die such that gravity forces cooler fluid to the micro-channels. The micro-channels may be shaped for preferential fluid flow along one direction of the die. The condenser may contain fins to enhance heat transfer to air adjacent the condenser.

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