Method of cooling electronic devices using a tube in plate heat

Heat exchange – With retainer for removable article – Electrical component

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165168, 165146, 361699, 361719, H05K 720

Patent

active

058266437

ABSTRACT:
A method of cooling electronic devices in an electronic assembly is proposed where the said assembly has at least one board that houses electronic modules. The methodology comprises shaping a light weight plate with apertures as to compliment the geometric shape of the assembly and board to be cooled; affixing coolant passage tubes in the apertures of the plate and finally cooling the electronic assembly by placing the assembly in thermal contact with the plate and passage tubes after a coolant is introduced in the passages.

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