Method of cooling an electrical device using a heat sink attache

Details Method of cooling an electrical device using a heat sink attache Method of cooling an electrical device using a heat sink attache

1993-05-18

1994-08-23

Vo, Peter Dungba

Metal working

Method of mechanical manufacture

Electrical device making

29843, 174 163, 257718, H05K 334, H05K 720

Patent

active

053395190

ABSTRACT:
A method of attaching a heat sink to a circuit board for cooling an electrical device mounting system employing a plurality of heat conductive layers embedded in a printed circuit board where heat conduction therebetween is facilitated by a plurality of heat conduction channels passing through one layer to another where the heat generated by the semiconductor device is conducted into the conducting layers via the heat conduction channels and into a heat dissipation device, such as an aluminum heat sink.

REFERENCES:
patent: 4535385 (1985-08-01), August et al.
patent: 4547834 (1985-10-01), Dumont et al.
patent: 4729061 (1988-03-01), Brown
patent: 4810563 (1989-03-01), DeGree et al.
patent: 5043845 (1991-08-01), McDermott et al.
patent: 5155661 (1992-10-01), Nagesh et al.

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