Method of cooling a semiconductor device with a cooling unit, us

Details Method of cooling a semiconductor device with a cooling unit, us Method of cooling a semiconductor device with a cooling unit, us

1989-04-10

1991-05-07

Price, Carl D.

Heat exchange

Regenerator

Checker brick structure

165185, 165 803, 165 804, 357 81, 357 82, 420555, 361385, 361386, 361387, H05K 720, F28D 2100

Patent

active

050128582

ABSTRACT:
A method of cooling a semiconductor device with a cooling unit, using a metal sherbet, which is metal being in a state of a mixed phase consisting of a liquid phase and a solid phase, as a heat conducting body put between the cooling unit and the semiconductor device for transferring heat generated in the semiconductor device to the cooling unit. The metal sherbet is metal, such as In-Ga binary system, in which solids of In-Ga solid solution are dispersed in an In and Ga liquid at a temperature obtained under normal operations of the semiconductor device and the cooling unit.

REFERENCES:
patent: 3852803 (1974-03-01), Gec
patent: 4446916 (1984-08-01), Hays
patent: 4639829 (1987-01-01), Ostergren et al.
patent: 4649990 (1987-03-01), Kurihara et al.
patent: 4682566 (1987-07-01), Aitken
patent: 4729060 (1988-03-01), Yamamoto et al.
patent: 4879632 (1989-11-01), Yamamoto et al.
W. J. Kleinfelder et al., "Liquid-Filled Bellows Heat Sink", vol. 21, No. 10, Mar. 1979, p. 4125, IBM Technical Disclosure Bulletin.
J. K. Hassan et al., "Chip Cooling Employing a Conformable Alloy", vol. 24, No. 11A, Apr. 1982, p. 5595, IBM Technical Disclosure Bulletin.

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