Method of cooling a semiconductor device with a cooling unit, us

Details Method of cooling a semiconductor device with a cooling unit, us Method of cooling a semiconductor device with a cooling unit, us

1989-05-08

1991-06-18

Price, Carl D.

Heat exchange

Regenerator

Checker brick structure

165 803, 165 804, 165185, 357 82, 357 81, 420555, 361385, 361386, 361387, H05K 720, F28D 2100

Patent

active

050242644

ABSTRACT:
A method of cooling a device with a cooling unit, using a metal sherbet, which is metal being in a state of a two-phase composition consisting of a liquid phase and a solid phase, as a heat conducting body put between the cooling unit and the heat generating device for transferring heat generated in the device to the cooling unit. The metal sherbet is metal, such as an In-Ga binary system, in which solids of an In-Ga solid solution are dispersed in an In and Ga liquid at a temperature obtained under normal operations of the device and the cooling unit.

REFERENCES:
patent: 4639829 (1987-01-01), Ostergren et al.
patent: 4649990 (1987-03-01), Kurihara et al.
patent: 4682566 (1987-07-01), Aitken
patent: 4729060 (1988-03-01), Yamamoto et al.
patent: 4879632 (1989-11-01), Yamamoto et al.
W. J. Kleinfelder et al., "Liquid-Filled Bellows Heat Sink", vol. 21, No. 10, Mar. 1979, p. 4125, IBM TDB.
J. K. Hassan et al., "Chip Coding Employing a Comformable Alloy", vol. 24, No. 11A, Apr. 1982, p. 5595, IBM TDB.

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