Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-06-07
1996-10-29
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
174 163, 361720, H05K 330
Patent
active
055686834
ABSTRACT:
A removable heatsink assembly comprised of a heatsink unit and a heatspreader is provided. The heatsink unit has at least one fin and a coupling collar for radiating heat away from a packaged electronic device. The heatspreader includes a platform attached to an inner collar in thermal contact with the packaged electronic device. The platform has one or more tabs suitable for mating with one or more flanges located on the coupling collar of the heatsink unit. Coupling grooves within the flanges engage the platform of the heatspreader when the flanges are mated with the heatspreader tabs and the heatsink is turned. The heatsink can therefore be quickly and conveniently attached to or removed from the heatspreader. The present invention thus permits a wide variety of different heatsinks to be interchangeably used with a single heatspreader attached to an electronic device package.
REFERENCES:
patent: 4594643 (1986-06-01), Hermann
patent: 4660123 (1987-04-01), Hermann
patent: 4716494 (1987-12-01), Bright et al.
patent: 4879632 (1989-11-01), Yamamoto et al.
patent: 5019940 (1991-05-01), Clemens
patent: 5132875 (1992-07-01), Plesinger
patent: 5191511 (1993-03-01), Sawaya
patent: 5257162 (1993-10-01), Crafts
Alagaratnam Manian
Chia Chok J.
Lim Seng-Sooi
Low Qwai H.
Arbes Carl J.
LSI Logic Corporation
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