Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1989-12-27
1991-10-22
Tentoni, Leo B.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156164, 15624411, 264 401, 264 406, 264171, 2642106, 2642107, 264211, 2642902, 364473, 364563, B29C 4706, B29C 4792, B32B 3130
Patent
active
050592653
ABSTRACT:
The thickness of a biaxially oriented resin film is controlled by reading the thickness distribution of the oriented resin film prior to rolling up thereof and separating the readings into modes by harmonic analysis (Fourier transformation) using a computer. The modes are then divided into modes of a low frequency component and a high frequency components by a predetermined border mode. The deviation is controlled in the profile of the low frequency component by adjusting die bolts as well as controlling the deviation in the profile of the high frequency component by regulating temperatures of a number of heater elements in an oven.
REFERENCES:
patent: 3782873 (1974-01-01), Lynnknowles
English-Language Translation of Japanese Reference 63-50, 179.
Oji Yuka Goseishi Co. Ltd.
Tentoni Leo B.
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