Method of controlling the temperature of a portion of an electro

Details Method of controlling the temperature of a portion of an electro Method of controlling the temperature of a portion of an electro

1995-03-10

1997-07-15

Heinrich, Samuel M.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228 46, H05K 334

Patent

active

056475292

ABSTRACT:
A method for controlling the temperature of a predetermined portion of an electronic part during the solder reflow process. The method includes the steps of applying (107) an absorbent material containing a fugitive material (109) to a predetermined portion of an electronic part which must be kept below the solder reflow temperature to prevent damage. Heat is then applied and the electronic part is subjected to a high reflow temperature capable of allowing solder to melt. The predetermined portion of the electronic part is controlled (113) at a substantially lower temperature than the high temperature due to evaporative cooling properties of the fugitive material avoiding damage to the electronic part.

REFERENCES:
patent: 3430686 (1969-03-01), Parkison et al.
patent: 3616533 (1971-11-01), Heap et al.
patent: 5230462 (1993-07-01), Vascak et al.
Electronic design, "Wet Felt Sinks Heat", p. 103, Apr. 1, 1959

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