Method of controlling the spread of an adhesive on a circuitized

Details Method of controlling the spread of an adhesive on a circuitized Method of controlling the spread of an adhesive on a circuitized

1996-10-31

1999-06-08

Pianalto, Bernard

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

427 96, 4272071, 4272086, 427265, 4274121, 427536, 427537, 427539, 427569, C23C 1402

Patent

active

059103418

ABSTRACT:
A method for preparing a circuitized organic substrate for the subsequent deposition of an adhesive thereon is provided. The method comprises exposing the circuitized substrate to a plasma formed from a gas mixture comprising a fluorine-containing entity. Preferably, the gas mixture used to form the plasma also comprises oxygen. It has been determined that treatment of the circuitized substrate with a plasma formed from a gas mixture comprising at least 20% by volume of the fluorine-containing entity and, preferably, up to about 80% by volume of oxygen reduces the spread of an adhesive deposited on the surface of the organic substrate. It has also been determined that such treatment does not adversely affect the subsequent bonding of wires to the wire bond sites that are present on the surface of the substrate.

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