Method of controlling the spread of an adhesive on a circuitized

Details Method of controlling the spread of an adhesive on a circuitized Method of controlling the spread of an adhesive on a circuitized

1998-07-01

2000-08-08

Jones, Deborah

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

428672, 428901, 438106, 106 2, 106243, B32B 2704, B32B 3300, C09D 516, C08L 9100

Patent

active

060999594

ABSTRACT:
In accordance with the present invention, a method of treating the surface of an organic substrate, particularly a circuitized surface of an organic substrate, which method reduces the spread of adhesive resin that is subsequently deposited on the surface, is provided. This method comprises the steps of applying a treatment solution comprising a fatty acid compound, an alkalizing agent, and a solvent comprising water and from about 5% to about 90% by volume of an organic solvent selected from the group consisting of an alcohol, a glycol ether, and combinations thereof to the surface; and then removing substantially all of the solvent from the solution to provide a thin film on the surface of said substrate. The film comprises the fatty acids that were present in the treatment solution. In a preferred embodiment the treatment solution further comprises a chelating agent. The present invention also relates to a treatment solution for reducing adhesive resin bleed on the surface of a circuitized organic substrate. The present invention also relates to a circuitized organic substrate that is resistant to resin bleed. Such substrate has a film comprising a fatty acid compound disposed on the circuitized surface thereto.

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